Description -
This role serves as a senior mechanical and thermal engineering leader responsible for driving large, complex initiatives that directly impact the company’s long-range goals and product strategy. The position defines and leads 3– 5 year technology roadmaps for thermal and mechanical engineering, identifying key inflection points in Phase Change Materials (PCM), vapor chamber technologies, and active cooling innovations.
The role operates at the system architecture level, leveraging deep technical expertise in thermal fluids, simulation, and hardware design to influence decision-making at the highest organizational levels. This leader partners closely with silicon vendors, software, firmware, and hardware teams to co-design solutions optimized for performance, performance per watt, acoustics, skin temperature, and form factor , while ensuring compliance with enterprise standards across multiple organizations and architectures.
Lead multi-year thermal technology roadmaps, identifying and advancing innovations in PCM, vapor chambers, fans, heat pipes, and active cooling solutions across the portfolio
Lead multiple project teams of mechanical and thermal engineers, along with internal and outsourced development partners, across all phases of development including concept, design, validation, tooling, testing, and production readiness
Review designs and project activities for compliance with engineering standards, development guidelines, and quality requirements, providing actionable feedback to improve product outcomes
Troubleshoot complex mechanical, thermal, electrical, and system-level issues with minimal supervision
Guide and mentor less-experienced engineers, setting a standard for thermal design innovation, rigor, and excellence
Education & Experience Recommended
Required Technical Expertise
Strong thermal analysis expertise using CFD tools such as Flotherm XT, FLOEFD, Icepak , or equivalent
Cross-Organizational Skills
Invents, develops, and introduces new thermal methods, frameworks, and technologies that impact multiple disciplines, platforms, and work groups
Disclaimer
This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.
The pay range for this role is $174,050 to $278,450 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:
- Health insurance
- Dental insurance
- Vision insurance
- Long term/short term disability insurance
- Employee assistance program
- Flexible spending account
- Life insurance
- Generous time off policies, including;
- 4-12 weeks fully paid parental leave based on tenure
- 11 paid holidaysAdditional flexible paid vacation and sick leave ( US benefits overview )
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job -
Engineering
Schedule -
Full time
Shift -
No shift premium (United States of America)
Travel -
Relocation -
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “ Know Your Rights: Workplace Discrimination is Illegal "
