Job Description
At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.
We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enable the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators: join us and put your passion, determination, and skills to work building the future!
#TheFutureIsBuiltHere #ChangeTheWorld
Within BR&T, Boeing’s Solid State Electronics Development organization (SSED) performs microelectronics technology development for aerospace systems. SSED develops digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic functions. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state-of-the-art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication services but executes the whole design flow in-house (architecture definition, circuit design, RTL, synthesis, physical layout, verification, packaging and testing). SSED owns numerous microelectronics projects, funded both by internal Boeing programs and external U.S. Government Science and Technology (S&T) customers. SSED’s large staff of microelectronics engineers conducts research and designs microelectronics hardware in support of these projects.
Currently SSED is actively hiring an Associate Analog Mixed Signal Integrated Circuit (IC) Design Engineer, who has expertise Analog Mixed Signal Design or has course work in their MS/PhD in analog, mixed signal and VLSI. The Mixed Signal Design Engineer is expected to contribute all phases of design and development from requirement definition, initial concepts, and architecture and trade studies; through behavioral modeling, circuit design and layout implementation. As well as ability to define test plans and supply testing of the chips in a lab.
This position will be based out of Tukwila, WA.
Position Responsibilities:
Design of Mixed-Signal IC macros from specification to tape out, including:
ADCs/DACs and other signal converters
DLLs/PLLs and other timing circuits
High Speed SerDes interfaces
Analog precision blocks such as Voltage/Current references, Temperature sensors, Signal conditioning channels
Power Management blocks such as linear or switching regulators
Specialized design for extreme temperatures, harsh radiation environments, ultra-low-power and low-area solutions
Layout execution and supervision
Documentation development for design traceability and testing enablement
Circuit test and characterization in a laboratory environment
This position is expected to be 100% onsite. The selected candidate will be required to work onsite at one of the listed location options.
This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret clearance Post-Start is required.
Basic Qualifications (Required Skills/Experience):
Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
Experience in the design/development of Integrated Circuits
Experience with Electronic Design Automation (EDA) tools and methodologies for Mixed-Signal design
Preferred Qualifications (Desired Skills/Experience):
Proven ability to derive requirements and complying with specifications in circuits and systems
Must have designed and released for fabrication at least one of the Mixed-Signal macros
Greater than the minimum level of design experience in Analog, Digital, Mixed-Signal, RF domains, or experience designing and/or testing chips in more than one domain.
Experience with commercial Cadence tools (Virtuoso suite and Spectre simulator products)
Experience working on large-scale SoC design teams.
Experience developing Mixed-Signal circuits in state-of-the-art semiconductor fabrication processes (e.g. 7/10/12/14/16nm FinFET CMOS, 22nm FDSOI CMOS, BiCMOS)
Experience developing Analog/Mixed-Signal ICs for extreme environment applications (e.g. radiation-hardened, extreme low/high temperatures, ultra-long lifetime)
Experience with development of Analog/Mixed-Signal circuits for hardware security applications
Experience supporting military radar, communications, electronic warfare, or avionics/mission data processing programs
Demonstrated track record as a high performance team member
Excellent verbal and written communication ability
Active security clearance
Typical Education/Experience:
Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 2 or more years' related work experience or an equivalent combination of technical education and experience (e.g. Master). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.
Relocation:
This position offers relocation based on candidate eligibility.
Drug Free Workplace:
Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.
Shift Work Statement:
This position is for 1st shift.
Union:
This is a union represented position.
Employee Referral:
Referral to this job is eligible for bonus.
At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.
The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.
The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.
Pay is based upon candidate experience and qualifications, as well as market and business considerations.
Summary pay range: $85,850 - $116,150
Applications for this position will be accepted until November 25th, 2024
Export Control Requirements: U.S. Government Export Control Status: This position must meet export control compliance requirements. To meet export control compliance requirements, a “U.S. Person” as defined by 22 C.F.R. §120.15 is required. “U.S. Person” includes U.S. Citizen, lawful permanent resident, refugee, or asylee.
Export Control Details: US based job, US Person required
Equal Opportunity Employer:
Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.
