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Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products.
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Be involved in research efforts including initial concepts, advanced technology demonstrations, and will have the opportunity to follow product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of a range of microelectronics products.
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Follow established procedures in creation of technical data package work products, while working closely with program management and functional supervision to ensure the overall design objectives are met.
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Ability to work independently and in a team environment, including as a leader of small teams semiconductor manufacturing processes and materials.
Qualifications You Must Have:
Typically requires a Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) degree or a minimum of 5 years’ prior relevant experience, to include any combination of the following:
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Experience in circuit layout design using 2D CAD tools
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Experience performing mechanical and electrical engineering design
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Experience with semiconductor manufacturing processes and materials
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Experience with high density microelectronic packaging designs including Interposers, organic substrates, wafer and chip bumping
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Experience with electronic components / devices such as ASICs and FPGAs
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Experience with the design of electronic packaging chassis and structures, interconnects (connectors/cables), and / or thermal management design of high-density electronic systems and electronic enclosures
Qualifications We Prefer:
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RF circuit design, including 3D EM simulation in HFSS or similar tools
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Circuit layout design experience using 2D and 3D CAD tools (Cadence Virtuoso and/or Allegro/APD+)
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Experience and familiarity with selection and oversight for semiconductor wafer processing and finishing (plating, bumping, dicing)
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Design experience with 3D and 2.5D packaging, complex CAD/EDA software design workflows, and RF/Thermal/Digital co-design
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Experience qualifying and implementing cutting edge materials, fabrication techniques, and understanding of relevant materials used in semiconductor manufacturing and packaging
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Strong background in development, documentation, fabrication, assembly, and test/delivery of military/defense and/or commercial state-of-the-art electronic products
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Experience with designing electronics for extreme environmental requirements and design constraints
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Proficiency with 3D Mechanical CAD modeling and analysis tools (e.g., Solidworks, Creo).
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Experience in Geometric Dimensioning and Tolerance analysis for drawings
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Possess an active security clearance
What We Offer
Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Trust, Respect, Accountability, Collaboration, and Innovation.
This position offers relocation based on candidate eligibility.
Learn More & Apply Now!
This position requires a security clearance. DCSA Consolidated Adjudication Services (DCSA CAS), an agency of the Department of Defense, handles and adjudicates the security clearance process. More information about Security Clearances can be found on the US Department of State government website here: https://www.state.gov/m/ds/clearances/c10978.htm
As part of our commitment to maintaining a secure hiring process, candidates may be asked to attend select steps of the interview process in-person at one of our office locations, regardless of whether the role is designated as on-site, hybrid or remote.
The salary range for this role is 86,800 USD - 165,200 USD. The salary range provided is a good faith estimate representative of all experience levels. RTX considers several factors when extending an offer, including but not limited to, the role, function and associated responsibilities, a candidate’s work experience, location, education/training, and key skills.Hired applicants may be eligible for benefits, including but not limited to, medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays. Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement.Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement. Payments under these annual programs are not guaranteed and are dependent upon a variety of factors including, but not limited to, individual performance, business unit performance, and/or the company’s performance.This role is a U.S.-based role. If the successful candidate resides in a U.S. territory, the appropriate pay structure and benefits will apply.RTX anticipates the application window closing approximately 40 days from the date the notice was posted. However, factors such as candidate flow and business necessity may require RTX to shorten or extend the application window.RTX is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability or veteran status, or any other applicable state or federal protected class. RTX provides affirmative action in employment for qualified Individuals with a Disability and Protected Veterans in compliance with Section 503 of the Rehabilitation Act and the Vietnam Era Veterans’ Readjustment Assistance Act.
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