Lockheed Martin Missiles and Fire Control (MFC) is seeking a Staff Electromechanical Design Engineer to serve as a technical authority and hardware lead within our electromechanical engineering organization, specializing in 3D Heterogeneous Integration (3DHI). MFC is a recognized designer, developer, and manufacturer of precision engagement aerospace and defense systems for the U.S. and allied militaries. This role is suited for an experienced electromechanical professional who can drive technical strategy, lead IPT efforts, mentor engineers, and ensure mission-critical hardware meets the highest standards of reliability and performance.
What You Will Be Doing
Microelectronics hardware development engineer with ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3DHI packages throughout their operational lifespans.
• Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.
• Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including operation shock and vibration.
• Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).
• Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates. Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.
• Architecting, designing, and validating advanced circuit card packages
• Designing high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints
• Designing and developing electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assemblies
• Leading and documenting design assurance reviews, tracking issues, and driving corrective actions to closure
• Performing thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments
• Coordinating with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budget
• Managing risk, schedule, and earned value metrics, and reporting status to senior leadership
• Setting clear technical direction for program engineers based on customer requests and program goals
• Mentoring and developing engineers, fostering an inclusive environment and driving continuous improvement initiatives
• Communicating technical status, risks, and recommendations clearly to internal stakeholders and external customers
This position offers the opportunity to shape the future of electromechanical engineering capabilities at Lockheed Martin and to have a significant impact across the MFC enterprise.
Candidates may be subject to a government security investigation and must meet eligibility requirements for access to classified information. Some travel may be required
