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At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.
THE ROLE
Lead the development, qualification, and manufacturing enablement of next-generation substrate technologies supporting AMD's advanced packaging roadmap. This role is focused on substrate process development, test vehicle strategy, yield optimization, process characterization, and rapid identification of technology risks during development and manufacturing ramp. You will drive substrate technology maturity from concept through high-volume production by developing process solutions, qualification methodologies, and test structures that accelerate learning cycles and improve manufacturing robustness. Will work closely with substrate suppliers, OSATs, product engineering, and manufacturing teams to enable industry-leading package substrate technologies with superior quality, yield, and reliability.
THE PERSON
The ideal candidate is a recognized technical leader with deep expertise in substrate manufacturing processes, test methodologies, materials interactions, process integration, failure analysis, yield engineering, and technology qualification.
They possess a strong understanding of substrate fabrication processes and have successfully developed and industrialized advanced substrate technologies. They can complex manufacturing challenges through data-driven engineering approaches and have extensive experience partnering with suppliers to optimize yield, reliability, and process capability.
KEY RESPONSIBILITIES
Substrate Process Development
- Lead development and qualification of advanced package substrate technologies for future AMD products.
- Drive process integration across substrate manufacturing flows, including imaging, lamination, via formation, metallization, plating, surface finish, and assembly interfaces.
- Define process capability requirements and technology readiness criteria for new substrate platforms.
- Develop and evaluate next-generation substrate materials and process innovations.
Test Vehicle & Characterization Development
- Define substrate test vehicle strategies to evaluate technology capabilities, process margins, and manufacturability.
- Lead development of characterization methodologies for process capability assessment and technology qualification.
- Establish learning plans that accelerate process development and supplier technology readiness.
- Develop critical process monitors and technology health indicators.
Yield Improvement & Manufacturing Excellence
- Drive yield learning activities across development and production phases.
- Lead root-cause analysis and corrective actions for substrate-related manufacturing excursions.
- Develop statistical methodologies and process control strategies to improve manufacturing robustness.
- Partner with suppliers to improve defect density, process capability, cycle time, and manufacturing efficiency.
- Establish yield roadmaps and drive continuous cost reduction initiatives.
Reliability & Qualification
- Develop qualification plans and reliability assessment methodologies for emerging substrate technologies.
- Lead technology risk assessments and mitigation planning.
- Support customer qualification, technology certification, and manufacturing release activities.
- Partner with reliability engineering teams to identify and resolve process-induced failure mechanisms.
Supplier & Ecosystem Development
- Engage substrate suppliers, OSATs, and material vendors to develop process innovations.
- Evaluate supplier technology readiness and manufacturing capability.
- Influence supplier roadmaps for future substrate and material technologies.
- Drive technical problem-solving across the supply chain.
PREFERRED EXPERIENCE
- Semiconductor packaging experience.
- Extensive experience in substrate process development, process integration, and manufacturing engineering.
- Strong background in yield engineering, defect reduction, statistical process control, and process characterization.
- Experience developing test vehicles and qualification methodologies for advanced substrate technologies.
- Hands-on experience with ABF (Ajinomoto Buildup Film) substrates, advanced HDI (high density interconnect) technologies, fine-line processes, and advanced via structures.
- Strong understanding of reliability physics and failure analysis methodologies.
- Proven success in manufacturing ramp support and yield improvement leadership.
- Experience working directly with substrate suppliers and OSAT partners.
- Ability to communicate complex manufacturing and technical issues to executive leadership.
This role is not eligible for visa sponsorship.
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Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
